Exhibitions & Events
TESTUPS participates in leading EMC conferences and trade shows worldwide. Visit our booth to discuss your EMC challenges with our engineers.
Upcoming Events
Come meet us at our next exhibition
EMC+SIPI 2026
2026 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity
Join TESTUPS at Booth #422 for the premier IEEE EMC+SIPI symposium. Five days of technical sessions, workshops, tutorials, and exhibitions covering the latest in electromagnetic compatibility and signal & power integrity.
A personal invitation from TESTUPS — see you at Booth #422!
EMV-Fachtagung 2026
23rd EMV-Fachtagung 2026 — EMC Conference at TU Graz
Meet TESTUPS at the 23rd EMV-Fachtagung, a leading international EMC conference held in English at Graz University of Technology. Join us across all four days (15–18 September) of technical sessions, training and exhibition.
EMC Hungary 2027
EMC Hungary 2027 (EMCH2027) — International Conference on Electromagnetic Compatibility
Join TESTUPS at EMCH2027 in Kecskemét — the second edition of the international EMC conference where measurement, simulation and design meet across academia, automotive and aerospace. Expect 200+ attendees and 30+ technical sessions from 20+ countries, endorsed by the IEEE EMC Society.
Previous Exhibitions
Events where TESTUPS has exhibited
EMC+SIPI 2025
2025 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity
EMC Hungary 2025
EMC Hungary 2025 — International Conference on Electromagnetic Compatibility
EMC Türkiye 2019
EMC Türkiye 2019 — Fifth International Conference on Electromagnetic Compatibility
Want to Meet Us at an Event?
Get in touch to schedule a meeting at our next exhibition booth or discuss your EMC project requirements.
Contact UsCity photographs via Wikimedia Commons — Dallas — Michael Barera, CC BY-SA 4.0 · Graz — Nick Savchenko, CC BY-SA 2.0 · Kecskemét — bree88, CC BY-SA 2.5 · Raleigh — Abhiram Juvvadi, CC BY-SA 4.0 · Balatonalmádi — Szilas, public domain · Gebze — Wikimedia Commons, CC BY-SA 2.5.